LC Universal Bond Kit

7th generation light-cured universal bonding agent compatible with Self-Etch, Selective Etch, and Total Etch techniques. Features innovative MDP technology delivering high adhesion values of 35 MPa to dentin and 19.1 MPa to enamel, and works effectively on wet, moist, or dry surfaces. Indicated for direct composite and compomer restorations, core build-ups, indirect restorations (inlays, onlays, crowns, bridges), and composite repair procedures. Package contains 1 kit.